Laser Scribing and Cutting Services

Cut materials with accuracy and precision with our laser cutting and scribing services. Using infrared and ultraviolet wavelengths, we cut different materials, from delicate to hard, to any type of material thickness. Our laser-cutting process ensures that the material remains undamaged and in pristine condition.


Laser cutting of virtually any thin material is nearly always accomplished best by laser cutting, which performs with greater accuracy and less damage than any other method. Using a full array of Infrared and Ultraviolet wave lengths, Laserod has developed procedures for laser cutting of hundreds of types of material, ranging from softer materials (e.g., aluminum) to diamonds and very delicate films.

In recent years, picosecond and femtosecond laser cutting has become more and more in use in implanted medical devices such as stents, which are made to rigorous tolerances (often 10-20 microns) and must show no damage to the material. Because of the potential of damage that can result from precision laser cutting, an accompanying gas, usually oxygen or nitrogen, is often used. Given Laserod’s over forty years of experience with lasers working on a vast array of material types, our experienced personnel know which gas works best with each material, and precisely how much will achieve the desired result.

Equally important are positioning devices, such as stages or galvanometers, which operate at a multiplicity of speeds. Laserod’s production facility has positioning devices for all shapes, including tubes, that can operate at speeds from a dead stop to several meters per second.

One advantage of laser cutting versus other methods is the laser’s ability to cut a single layer or several layers of a multi-layered laminate without affecting other layers on the board. Such demanding requirements can only be done with precision laser cutting.

For further detailed information, contact our Sales Department or Request a Quote.

Laser Types

1064nm/532nm/355nm wavelengths

1064nm/532nm/355nm wavelengths

1064nm/532nm/355nm/266nm wavelengths


  • Stainless Steel
  • Aluminum
  • Glass
  • Sapphire
  • Ceramic
  • Plastics
  • Silicon
  • Diamond
  • Kapton
  • Copper
  • Carbon Fiber
  • Composites

**Plus many others**


Substrate Size: Up to 700mm x 700mm

Substrate Thickness: Up to 3mm

Kerf Width: Down to 10um

Feature Registration: +/-5ums

Types of Hole Drilling