With 40 Years of Wafer Coring Experience
Laserod has separated itself as a leader in Wafer Coring and
Wafer Processing Services. Serving the entire United States.
Wafer Coring Services
- Coring/Resizing ANY SIZE with starting wafer up to 20”
- Single Wafer or Multiple Wafer Cutouts per starting wafer
- Edge Beveling / Edge Rounding
- Marking/Serializing—Alphanumeric, QR Codes, Dot Matrix
- Wafer Dicing/Die Singulation—down to 10um kerf widths
- Wafer Trenching–+/-5um of depth control
- Hole Drilling—Through Holes, Via Holes, and/or Blind Hole/Via Drilling
Capabilities
Laser Types
Femtosecond
1064nm • 532nm • 355nm wavelengths
Picosecond
1064nm • 532nm • 355nm wavelengths
Nanosecond
1064nm • 532nm • 355nm • 266nm wavelengths
Materials
- Silicon
- Silicon Carbide
- Glass
- Sapphire
- Ceramic
- GaAs
- GaN
- Germanium
*Plus many others
Specs
Wafer Size: Up to 20″
Wafer Thickness: Up to 3mm
Tolerances: Down to +/-10ums
Kerf Width: Down to 10ums
Feature Registration: +/-5ums
Notch/Flat Alignment: +/-.1 degrees
NEED A SAMPLE?
Every project is unique, but we are confident we can make it work. Send us material and a drawing and we will produce a free sample.
LOOKING FOR MORE INFO?
Most projects we work on are custom. If you’re looking for more information about how Laserod can help with your project, our sales and engineering team are here to assist you.
Industries we work with
Laser wafer processing technology is critical to many different industries due to its ability to achieve high precision, improve manufacturing yields, enable miniaturization, and enhance the performance of semiconductor-based products and devices.
Semiconductor Manufacturing
Laser wafer processing is fundamental in semiconductor fabrication for various applications, including integrated circuits (ICs), microprocessors, memory chips, and sensors. It is used for cutting, dicing, scribing, annealing, and drilling in wafer manufacturing processes.
Microelectronics
Beyond semiconductor manufacturing, laser wafer processing is integral to producing microelectronic devices such as LEDs (Light Emitting Diodes), photovoltaic cells (solar panels), and microelectromechanical systems (MEMS).
Photonics and Optoelectronics
Laser processing is essential for fabricating components in the photonics industry, including optical waveguides, photonic integrated circuits (PICs), and optoelectronic devices like lasers and detectors used in telecommunications and data communications.
Medical Devices
Laser processing of wafers is critical in manufacturing components for medical devices such as pacemakers, hearing aids, diagnostic equipment, and implants. It enables precision manufacturing of miniaturized devices with complex structures.
Aerospace and Defense
Laser wafer processing is used in the aerospace and defense industries to manufacture advanced sensors, radar components, communication systems, and aerospace-grade electronics where reliability and performance are critical.
Automotive
Laser processing of wafers is utilized in automotive electronics for sensors, control systems, and driver assistance technologies. It helps manufacture components that enhance vehicle safety, efficiency, and performance.
Consumer Electronics
Laser wafer processing plays a crucial role in producing of consumer electronic devices such as smartphones, tablets, cameras, and wearable technology. It enables the fabrication of compact and high-performance electronic components.
Energy and Renewable Energy
Laser processing is employed in the energy sector to manufacture components in renewable energy technologies such as solar cells and photovoltaic modules. It helps improve efficiency and reduce production costs.
Research and Development
Laser wafer processing is extensively used in research laboratories and academic institutions to prototype new semiconductor devices, explore novel materials, and advance semiconductor technologies.
Biotechnology and Life Sciences
Laser processing of wafers is also applied in biotechnology for manufacturing lab-on-a-chip devices, biosensors, and diagnostic tools. It facilitates the development of innovative solutions for healthcare and life sciences applications.
Advantages of Laser Processing
Laser processing offers significant advantages in terms of precision, speed, flexibility, and quality in the manufacturing of semiconductor wafers, contributing to advancements in semiconductor technology.
Precision and Accuracy
Lasers can achieve extremely high levels of precision, making them ideal for tasks such as etching, cutting, and patterning on wafers. This precision ensures that intricate designs and features can be accurately produced.
Non-contact Processing
Laser processing is a non-contact technology, meaning there is no physical contact between the laser and the wafer surface. This reduces the risk of contamination and damage to delicate semiconductor materials.
Versatility
Lasers can be used for a variety of processes, including cutting, drilling, ablation, and surface modification. This versatility allows multiple steps in the semiconductor manufacturing process to be performed using the same tool.
Speed
Laser processing can be very fast compared to traditional mechanical methods. This is particularly beneficial in high-volume manufacturing environments where throughput is crucial.
Flexibility in Design
Lasers enable the fabrication of complex geometries and patterns that may be challenging or impossible with traditional methods. This flexibility supports the design and production of advanced semiconductor devices.
Minimal Material Waste
Laser processing can be highly efficient, leading to minimal material waste compared to traditional methods. This is important in reducing manufacturing costs and optimizing material usage.
Quality and Consistency
Laser processing can help improve the overall quality and consistency of semiconductor devices by reducing defects and variability in manufacturing.
Reduced Chemical Usage
In some processes, laser processing can reduce or eliminate the need for chemicals, leading to a cleaner and more environmentally friendly manufacturing process.
