Gallery
Photos by Laser Application
Laser Etching
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Patterning_Marking--50um feature on Stainless Steel (varying-depths)
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Patterning_Marking--50um feature on Stainless Steel
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Patterning_Marking--QR Code 395um x 395um
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Patterning--5um holes in gold coated glass
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Patterning--15um wide ablation lines on photo resist
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Patterning--20 um wide x 100 um spacing gold removal on glass
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Patterning--25um wide x 75um pitch ablation of silver paste
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Patterning--30um gap x 100um trace in Silver Paste
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Patterning--30um wide ablation lines in ITO on glass
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Patterning--40um wide ablation line in ITO
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Patterning--50um wide line in thin film gold
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Patterning--75um gaps on Aluminized PET
Laser Drilling
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Hole Drilling--1mm dia blind via in Silicon
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Hole Drilling--2 mm hole in 400um thick Silicon
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Hole Drilling--10um dia to 100um dia holes in Unfired Ceramic
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Hole Drilling--20um dia holes in 250um thick Stainless Steel
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Hole Drilling--75um dia hole in 250um thick Silicon (minimal-HAZ)
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Hole Drilling--100 um dia holes in 500um thick Silicon
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Hole Drilling--125um square pillars in 500um thick Copper
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Hole Drilling--175um dia hole in 500um thick synthetic diamond
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Hole Drilling--200um deep blind hole in Epoxy down to Copper
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Hole Drilling--500um dia holes x 725u center to center spacing in 1mm thick Stainless Steel
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Hole Drilling 800um
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Hole Drilling
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Hole-Drilling--10um dia holes in 250um thick Ceramic
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Hole-Drilling--10um dia holes in 500um thick Stainless Steel (1,000 holes)
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Hole-Drilling--11um dia holes x 100um pitch in 75um thick Stainless Steel
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Hole-Drilling--25um dia holes in 250um thick Ceramic
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Hole-Drilling--25um dia holes in 500um thick Ceramic
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Hole-Drilling-25um-dia-micro-via-hole-drilling-opti
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Hole-Drilling--50um dia holes in composite medical device
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Hole-Drilling--65um dia hole in 250um thick Stainless Steel (micro-view)
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Hole-Drilling-65um-diameter-holes-250um-thick-Stainless-Steel-macro-view-opti
Laser Cutting & Scribing
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Cutting--500um thick Stainless Steel
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Cutting--Complex Shapes in 500um thick Copper
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Cutting--Custom Design in 250um thick Silicon
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Cutting--Nitinol Medical Device (close-up)
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Cutting--Nitinol Medical Device 2
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Cutting--Nitinol Medical Device
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Marking--50um feature on Stainless Steel (varying-depths)
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Marking--50um feature on Stainless Steel
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Scribing--30um scribe line in Silicon
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Cutting--3mm Cutout in 250um thick Stainless Steel
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Cutting--3mm part in 25um thick wall Nitinol tube
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Cutting--3mm part in 25um wall thickness Nitinol tube
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Cutting--50um wide beams in 250um thick Carbon Fiber
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Cutting--50um wide ribs x180um spacing in 100um thick Carbon Fiber
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Cutting--50um wide spiral beam in 25um thick wall Nitinol tube (close-up)
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Cutting--50um wide spiral beam in 25um thick wall Nitinol tube
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Cutting--50um wide spiral beam in Nitinol (close-up)
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Cutting--140um wide beams in Nitinol
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Cutting--180um wide cut in 125um thick PET
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Cutting--200 um thick Copper with 80um wide beams (macro-view)
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Cutting--200 um thick Copper with 80um wide beams (micro-view)
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Cutting--200 um wide cuts in kapton
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Cutting--250um thick Stainless Steel
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Cutting--250um wide beams in 500um thick Delrin
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Cutting--300um wide beams x 200um spacing in 150um thick Stainless Steel00 beams x 200 um opening
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Cutting--500um thick metal fiber composite material
Laser Dicing
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Wafer - Dicing 100um wide street in 500 um thick Silicon
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Wafer - Cutting Hole Drilling Custom Design in 500um thick-Silicon 2
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Wafer - Cutting Hole Drilling Custom design in 500um thick Silicon
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Wafer - Trenching 150um deep trenches in Silicon (macro-view)
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Wafer - Coring Cutting
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Wafer - Coring Cutting Variety of wafer coring and cutting
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Wafer - Coring Variety of resized wafers
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Wafer - Cutting 100um custom feature in 250um thick Silicon
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Wafer - Trenching 150um deep trench in Silicon (micro-view)
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Wafer - Marking Serializing QR Code 395um x 395um
