Wafers are thin silicon slices used in various electronics applications. They are usually lab-grown where purity is altered and controlled depending on the intended use of the wafer. Wafer dicing involves the process of separating die from a semiconductor layer after the wafer is processed. Wafer dicing is automated so that precision and accuracy can be achieved.
For laser micromachining services and products including wafer dicing in California, Laserod has got you covered.
Which Material is Used in Making Wafers?
A wafer is a thin piece of material that is a semiconductor. The wafer is used to make solar cells in photovoltaics. It is also used in the fabrication of the integrated circuits. All the wafers are made from silicon. Silicon happens to be the second most common chemical element on our planet after Oxygen gas.
Are There Other Materials That Can Be Used to Make Wafers Apart from Silicon?
There are other compounds which can be used to make wafers like II-V and III-V materials. The other material used to make wafers is GaAs (Gallium arsenide) which happens to be a level III-V semiconductor. The GaAs compound is a byproduct of the Czochralski process.
Are There Different Types of Silicon Wafers?
The most popular type of wafer is silicon. As a result, there are various types of silicon wafers. When looking for any wafer dicing service in California, it’s important to know the different types of silicon wafers. Below are the three types of wafers that you will find in the market:
- The Silicon on Insulator (SOI)wafer. A very thin layer of the wafer is needed to make electronic components.
- Epitaxial wafers. These wafers are used to attain surface integrity. They are available in two main types namely thin and thick epitaxial wafers. Thick epitaxial wafers are also known as multi-layered and are used in devices which control electric power. These wafers contribute to improving energy consumption efficiency. Thin epitaxial wafers, on the other hand, are mostly used for MOS devices.
- Polished wafers. These are silicon wafers that have been polished. The polishing can be on one side or both sides of the wafer.
It’s important to note that these wafers have different prices.
Does the Thickness of Wafers Vary?
Wafers come in different sizes. The materials used in constructing wafers mainly determine their thickness. Regardless of the material or semiconductor used in making the wafer, the thickness needs to be just enough to offer maximum support to the weight of the wafer. That will prevent the wafer from cracking when being handled. Wafers also have different diameters. The first semiconductor wafer was constructed in the U.S. in 1960 and had a diameter of one inch. Today, the average diameter of a wafer is 12 inches. There are plans of having wafers with diameters that are 18 inches long.
Wafer Dicing in California
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Wafer Dicing California
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