Are you looking for a Wafer Resizing Company?
Choosing a company that meets your unique electronic needs requires research and planning. Laserod delivers high-quality results and will help you with your wafer resizing projects. We have over forty years of experience in providing different products and services to the biggest industrial companies and the most prestigious universities. If you are looking for a wafer resizing company, look no further, give us a call and we will provide you with free advice and service or product quotation.
Resizing a wafer is a computer-guided laser cutting in creating holes, shapes, or cutting the entire wafer into different dies. The wafer can maintain the same orientation if the notch or flat is used as a starting point.
A laser can cut down a crystal wafer up to 0.05mm diameter. To avoid contaminants and protect the purity of the crystal during the cutting process, dust and particles are collected by a vacuum while the laser cuts through the wafer. A layer of photoresist can also be placed on the wafer surface before the cutting process to protect it from contaminants.
Wafers can be cleaned with a weak acid to take contaminants and unwanted particles, it can also repair damages caused during the cutting process. For solar cell use, wafers are textured with a rough surface to increase its efficiency. Another process that a wafer goes through is called etching, this is where the phosphosilicate glass generated at the edge of the wafer is being removed.
A single wafer if maximized can create multiple to billions of dies. The shape of a die is usually in a rectangular or square shape due to wafer dicing constraints. The sizing of a wafer is a complex computational problem that has no definite analytical solution. Its size is dependent on the area of the dies, its aspect ratio, aligned space occupied, test structures and scribeline size. Another consideration is the yield loss due to parametric issues or defects, therefore the wafer area that’s lost cannot be used to complete a die.
Wafers with a diameter of 200mm have cuts that are flats in one or more sides to show the crystallographic planes of a wafer. In the early generation of wafers, a pair of flats is at a different angle and convey a dope type or shape. If the diameter of a wafer is at 200 mm and above, a smaller single notch is used to convey the wafer’s orientation without a visual indication of the dope type.
Generally, silicon wafers are not pure 100% silicon, it is formed through a process of initial impurity doping. To define the wafer either bulk p-type or n-type, atoms of boron, arsenic, phosphorous, or antimony is added during the melt.
The difference of this process compared to a single silicon crystal is the atomic density of atoms, despite its difference, it still gives a greater purity of more than 99.9999%.
We, at Laserod, have a division that specializes in high precision resolution, small spot laser machining sizing, and resizing of wafer silicon. We are the best wafer resizing company that can cater to your machining and resizing needs.
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