Drilling Thin Materials
Laser Hole Drilling
Micro Via Laser Hole Drilling in Thin Materials
For both our shop service and our system integration:
Drilling holes small to large by the percussion and trepanning methods of laser drilling.
(Percussion is laser punching in a momentarily fixed position whereas trepanning is swinging the beam in a circle.)
For an informative 30 second clip on laser drilling view this Laser Drilling by Trepanning video.
Laser hole drilling in thin Stainless Steel(SS)
Laserod’s Capabilities and Guidelines for Hole Drilling:• accurate, repeatable small holes • any material except glass • to 1 mm max depth (.040″) • the thinner the material, the better the results . . . and the faster • two methods of drilling: trepanning and percussion • aspect ratio of depth to diameter is about 10:1. Please note this applies to percussion holes ONLY.
More Laser Drilling Capabilities:
Here are some more guidelines for laser hole drilling:• Max Hole or Via Depth: 3mm • Max Material Thickness: 3mm • Min Thickness: none • Max Diameter of Trepanned Hole or Via: 12″ (300mm) • Range of Percussion Hole Diameters: 10-125 microns depending on thickness • Min Diameter of Percussion Hole or Via: 10 microns • RE: “taper”: ask us. (We can control taper.) Taper for a 50um percussion hole in 300um thick silicon would be 50um eentrancediameter with 40um exit as a typical example.
Large hole laser trepanned in silicon wafer.
Drilling diamond means we can drill anything!
Laser Drilled Holes in CVD Diamond 30-200 Microns in Size
Narrow slots can be machined in any thin material including rubber and plastic.